汉纳芯片封装解决方案包括
1. 自动导线软件
2. 自动核图软件
3. 自动描图软件
自动导线系统的功能,就是将写在EXCEL文件里的NetList解析,配以合适的框架模板,自动生成DIE、PAD及相应的导线,并自动将其分层显示。
CHIP SIZE | 2600.0*2470.0 | ||||
Rotation | 270 | ||||
PAD No | PIN No | PAD NAME | X | Y | pad size |
1 | 1 | VDDTPC | -382.93 | 1148 | 60.0x60.0 |
2 | GND | GNDTP | -466.93 | 1148 | 60.0x60.0 |
3 | 2 | VDDTP | -550.93 | 1148 | 60.0x60.0 |
4 | 2 | VDDK | -710 | 1148 | 60.0x60.0 |
PAD No | PIN No |
D1.155 | 55 |
D1.156 | NC |
D1.157 | 56 |
D2.4 | GND |
D2.5 | GND |
D2.6 | 48 |
48 | GND |
Chip Size: | 3363.219x3987.567 | ||||
Rotation | 90 | ||||
PAD NAME | PAD No | X | Y | pad size | PAD_TYPE |
pad_ain0 | 1 | 144.90 | 52.20 | 50.00x50.00 | A |
pad_linein0_l | 2 | 209.70 | 52.20 | 50.00x50.00 | A |
pad_linein0_r | 3 | 274.50 | 52.20 | 50.00x50.00 | A |
pad_agnd | 4 | 424.09 | 52.20 | 50.00x50.00 | A |
Chip Size: | 1258x1354 | |||
Rotation | 90 | |||
PAD NAME | PAD No | X | Y | pad size |
CSB | 1 | 558 | 79 | 70x70 |
DO | 2 | 526 | 229 | 70x70 |
WPB | 3 | 526 | 359 | 70x70 |